JPH0210570B2 - - Google Patents

Info

Publication number
JPH0210570B2
JPH0210570B2 JP21282384A JP21282384A JPH0210570B2 JP H0210570 B2 JPH0210570 B2 JP H0210570B2 JP 21282384 A JP21282384 A JP 21282384A JP 21282384 A JP21282384 A JP 21282384A JP H0210570 B2 JPH0210570 B2 JP H0210570B2
Authority
JP
Japan
Prior art keywords
lead frame
magazine
stopper
wedge
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21282384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6190438A (ja
Inventor
Yoshihiko Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP21282384A priority Critical patent/JPS6190438A/ja
Publication of JPS6190438A publication Critical patent/JPS6190438A/ja
Publication of JPH0210570B2 publication Critical patent/JPH0210570B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • De-Stacking Of Articles (AREA)
JP21282384A 1984-10-11 1984-10-11 半導体装置用リ−ドフレ−ムの供給装置 Granted JPS6190438A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21282384A JPS6190438A (ja) 1984-10-11 1984-10-11 半導体装置用リ−ドフレ−ムの供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21282384A JPS6190438A (ja) 1984-10-11 1984-10-11 半導体装置用リ−ドフレ−ムの供給装置

Publications (2)

Publication Number Publication Date
JPS6190438A JPS6190438A (ja) 1986-05-08
JPH0210570B2 true JPH0210570B2 (en]) 1990-03-08

Family

ID=16628945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21282384A Granted JPS6190438A (ja) 1984-10-11 1984-10-11 半導体装置用リ−ドフレ−ムの供給装置

Country Status (1)

Country Link
JP (1) JPS6190438A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430836U (en]) * 1990-07-04 1992-03-12
JPH064773U (ja) * 1992-06-19 1994-01-21 有限会社アートシール印刷 ラベル用シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430836U (en]) * 1990-07-04 1992-03-12
JPH064773U (ja) * 1992-06-19 1994-01-21 有限会社アートシール印刷 ラベル用シート

Also Published As

Publication number Publication date
JPS6190438A (ja) 1986-05-08

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